Hydrogel electronic materials and microfabrication processes for soft …
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D. Won, H. Kim, T. S. Kim*, S. H. Ko*
Applied Physics Reviews [Prof. Taek-Soo Kim, Prof. Seung Hawn Ko]
관련링크
- 이전글Effect of W nucleation process on the adhesion of W/TiN/SiO2 structures for BEOL interconnects 26.05.07
- 다음글Dual-layered percolative networks of photoactive materials and elastomers for highly-stretchable, efficient organic photovoltaics with strain-induced power enhancement up to 60% strain 26.05.07
