Effect of W nucleation process on the adhesion of W/TiN/SiO2 structures for BEOL interconnects > 연구성과 | 글로벌 생체융합 인터페이싱 소재센터

Achievements

연구성과

GBMC의 연구성과를 확인하세요

Effect of W nucleation process on the adhesion of W/TiN/SiO2 structure…

페이지 정보

본문

S. W. Lee, D. J. Kim, J. Jeon, T. S. Kim*

Applied Surface Science [Prof. Taek-Soo Kim]

목록

관련링크

https://www.sciencedirect.com/science/article/pii/S016943322600958X
0회 연결

이전글Knowledge-guided strain-damage image correlation for diagnosing nonlinear mechanical behavior of freely stretched ultra-thin polymer films on water surface 26.05.07
다음글Hydrogel electronic materials and microfabrication processes for soft electronic applications 26.05.07